PCIe Splint Type, 64Pin, SMD
Product No
1B064xxx-0F00H
Product Description
64Pin, W/Hole, W/Post
Physical Characteristic:
1. Materials:
1.1. Housing: LCP+30% G/F, UL94 V-0;
1.2. Contact: Copper Alloy;
2. Plating:
2.1 Contact: Gold plating on contact area;
Tin on solder area;
Nickel underplating over all.
3. Electrical characteristics:
3.1 Current rating: 1.1 AMP per contact;
3.2 Insulation resistance: 1000 Megohms at 500V DC Min;
3.3 Contact resistance: 30 milliohms Max (initial);
4. Mechanical characteristics:
4.1 Insertion force: 1.15N Max per contact pair;
4.2 Withdrawal force: 0.15N Min per contact pair;
5. Environmental:
5.1 Temperature Range: -55°C to +85°C
1. Materials:
1.1. Housing: LCP+30% G/F, UL94 V-0;
1.2. Contact: Copper Alloy;
2. Plating:
2.1 Contact: Gold plating on contact area;
Tin on solder area;
Nickel underplating over all.
3. Electrical characteristics:
3.1 Current rating: 1.1 AMP per contact;
3.2 Insulation resistance: 1000 Megohms at 500V DC Min;
3.3 Contact resistance: 30 milliohms Max (initial);
4. Mechanical characteristics:
4.1 Insertion force: 1.15N Max per contact pair;
4.2 Withdrawal force: 0.15N Min per contact pair;
5. Environmental:
5.1 Temperature Range: -55°C to +85°C